Material-efficient Cu wire-based 3D printing technology

Area Acceleration (D2) Segment Upscaling (D2.2) Duration 2019/01/01-2021/12/31

News

Additive Manufacturing Meeting

28 listopada 2019

Date: the 18th-19th September 2019 Palce: Wrocław, Poland Our colleagues had a chance to take part in the Additive Manufacturing…


22nd International Conference on Advances in Materials & Processing Technologies

26 listopada 2019

Date: the 20th-24th of October 2019 Place: Taipei, Taiwan This conference is a big international event concerning the topic of…


Formnext Exhibition Frankfurt

21 listopada 2019

Date: the 19th-21th October 2019 Place: Frankfurt, Germany Fromnext is a leading global trade fair dedicated to additive manufacturing and…


Materializzando OFF

21 listopada 2019

Date: the 26th September 2019 Place: ENEA Faenza Laboratories (Italy) The 26th September 2019 “Materializzando OFF” took place in Faenza….


A visit from the Głogów Copper Smelter representatives

21 listopada 2019

Date: the 17th October 2019 Place: Łukasiewicz Research Network – Institute of Non-Ferrous Metals, Gliwice A meeting with The Głogów…


Meeting with Gefertec – scientific cooperation

13 listopada 2019

Date: the 14th -16th October 2019 Place: Łukasiewicz Research Network – Institute of Non-Ferrous Metals, Gliwice This was a meeting…


Project Partners

Łukasiewicz Research Network - Institute of Non-Ferrous Metals

  • Development of the Cu-based alloys
  • Development of production technology of feedstock materials for WAAM
  • Wire arc additive manufacturing at laboratory scale
  • Materials investigations

Ghent University

  • Corrosion-fatigue investigations
  • Tests of the prototypes in seawater environment
  • Educational activities

Italian National Agency for New Technologies, Energy and Sustainable Economic Development

  • Material investigations
  • Mechanical proporties

Gefertec GmbH

  • Development of the production process parameters by means of 3DMP technology
  • Implementation of the results of the project (end user)
  • Manufacturing of the new products

Tecnalia Research and Innovation

  • Erosion tests
  • Non-destructive tests

Acknowledgements

The project „3DMPWire. Material-efficient Cu wire-based 3D printing technology”, 2019-2021 (Upscaling) is cofunded by EIT RawMaterials.