Material-efficient Cu wire-based 3D printing technology

Area Acceleration (D2) Segment Upscaling (D2.2) Duration 2019/01/01-2021/12/31


Meeting of the Project Consortium at Gefertec

17 grudnia 2019

Date: 10-12 December, 2019 Place: Berlin, Germany This was a meeting of the members of the Project Consortium, which was…

Technical meeting with Bedra

16 grudnia 2019

Date: 2-3 December, 2019 Place: Heuchelheim, Germany This was a meeting concerning manufacturing of welding wires dedicated to additive manufacturing…

EIT RawMaterials CLC East Partner Meeting

16 grudnia 2019

Date: 26-28 November, 2019 Place: Graz, Austria This meeting was a time for presentations of projects, of ECLC Strategy, and…

Additive Manufacturing Meeting

28 listopada 2019

Date: 18-19 September, 2019 Place: Wrocław, Poland Our colleagues had a chance to take part in the Additive Manufacturing Meeting…

22nd International Conference on Advances in Materials & Processing Technologies

26 listopada 2019

Date: 20-24 October, 2019 Place: Taipei, Taiwan This conference is a big international event concerning the topic of materials and…

Formnext Exhibition Frankfurt

21 listopada 2019

Date: 19-21 October, 2019 Place: Frankfurt, Germany Formnext is a leading global trade fair dedicated to additive manufacturing and industrial…

Project Partners

Łukasiewicz Research Network - Institute of Non-Ferrous Metals

  • Development of the Cu-based alloys
  • Development of production technology of feedstock materials for WAAM
  • Wire arc additive manufacturing at laboratory scale
  • Materials investigations

Ghent University

  • Corrosion-fatigue investigations
  • Tests of the prototypes in seawater environment
  • Educational activities

Italian National Agency for New Technologies, Energy and Sustainable Economic Development

  • Material investigations
  • Mechanical proporties

Gefertec GmbH

  • Development of the production process parameters by means of 3DMP technology
  • Implementation of the results of the project (end user)
  • Manufacturing of the new products

Tecnalia Research and Innovation

  • Erosion tests
  • Non-destructive tests


The project „3DMPWire. Material-efficient Cu wire-based 3D printing technology”, 2019-2021 (Upscaling) is cofunded by EIT RawMaterials.