Material-efficient Cu wire-based 3D printing technology

Area Acceleration (D2) Segment Upscaling (D2.2) Duration 2019/01/01-2021/12/31


Scientific and Technical Conference of SITMN

24 czerwca 2022

Date:12-13th May 2022 Place: Wisła Project results were presented during this conference in a poster session.

15th International Invention and Innovation Show INTARG 2022

24 czerwca 2022

Date: 11-12th of May 2022 Place: Katowice During the 15th International Fair of Inventions and Innovations INTARG 2022 test products…

IX Forum of Non-Ferrous Metals

24 czerwca 2022

Date: 27-29th of April Place: Kraków This forum was a chance to present the project results.

Industrial Spring 2022

14 kwietnia 2022

Date: 6th of April 2022 Place: Kielce Trade fairs Industrial Spring 2022. Stom-Tool-Blech&Cutting-Laser-Robotics – Fix, Welding, Expo-Surface, Fluid Power, Control…

Visit to ENEA

18 lutego 2022

Date: 19-23th December 2021 Place: Faenza, Italy This visit was connected with delivering the printed prototypes of propellers which underwent…

Formnext 2021

3 grudnia 2021

Date: 15th-18th November 2021 Place: Frankfurt am Main The Formnext Fair is one the most important events connected with Additive…

Project Partners

Łukasiewicz Research Network - Institute of Non-Ferrous Metals

  • Development of the Cu-based alloys
  • Development of production technology of feedstock materials for WAAM
  • Wire arc additive manufacturing at laboratory scale
  • Materials investigations

Ghent University

  • Corrosion-fatigue investigations
  • Tests of the prototypes in seawater environment
  • Educational activities

Italian National Agency for New Technologies, Energy and Sustainable Economic Development

  • Material investigations
  • Mechanical proporties

Gefertec GmbH

  • Development of the production process parameters by means of 3DMP technology
  • Implementation of the results of the project (end user)
  • Manufacturing of the new products

Tecnalia Research and Innovation

  • Erosion tests
  • Non-destructive tests

Supported by