Material-efficient Cu wire-based 3D printing technology

Area Acceleration (D2) Segment Upscaling (D2.2) Duration 2019/01/01-2021/12/31


The First European Conference on Structural Integrity of Additively Manufactured Materials

12 września 2019

Date: 9-11 September 2019 Place: Trondheim, Norway From the 9th to the 11th of September Joanna Kulasa and Aleksander Kowalski…


4 września 2019

Date: the 3rd of September 2019 Place: IMN Gliwice On the 3rd of September we had the pleasure to host…

Research to Business (R2B) Fairs

20 sierpnia 2019

Date: the 6th of June 2019 Place: Bologna This event was a chance to hold meetings with companies and exchange…

The 19th Scientific and Cultural Week

20 sierpnia 2019

Date: 7th May 2019 Place: Faenza On this occasion some students had the opportunity to visit ENEA laboratory and learn…

24th Polish Materials Science Society Seminar

17 lipca 2019

Date: the 12th – 15th of May 2019 Place: Jachranka, Poland The seminar was organized by the Faculty of Materials…

Kick off Meeting: The official meeting starting the 3DMPWire. Material-efficient Cu wire-based 3D printing technology project

6 czerwca 2019

Date: the 30th of May 2019 Place: ŁUKASIEWICZ Research Network – Institute of Non-Ferrous Metals, Gliwice An official meeting to…

Project Partners

Łukasiewicz Research Network - Institute of Non-Ferrous Metals

  • Development of the Cu-based alloys
  • Development of production technology of feedstock materials for WAAM
  • Wire arc additive manufacturing at laboratory scale
  • Materials investigations

Ghent University

  • Corrosion-fatigue investigations
  • Tests of the prototypes in seawater environment
  • Educational activities

Italian National Agency for New Technologies, Energy and Sustainable Economic Development

  • Material investigations
  • Mechanical proporties

Gefertec GmbH

  • Development of the production process parameters by means of 3DMP technology
  • Implementation of the results of the project (end user)
  • Manufacturing of the new products

Tecnalia Research and Innovation

  • Erosion tests
  • Non-destructive tests


The project „3DMPWire. Material-efficient Cu wire-based 3D printing technology”, 2019-2021 (Upscaling) is cofunded by EIT RawMaterials.