Material-efficient Cu wire-based 3D printing technology

Area Acceleration (D2) Segment Upscaling (D2.2) Duration 2019/01/01-2021/12/31

News

Research to Business (R2B) Fairs

20 sierpnia 2019

Date: the 6th of June 2019 Place: Bologna This event was a chance to hold meetings with companies and exchange…


The 19th Scientific and Cultural Week

20 sierpnia 2019

19th Scientific and Cultural Week Date: 7th May 2019 Place: Faenza On this occasion some students had the opportunity to…


24th Polish Materials Science Society Seminar

17 lipca 2019

Date: the 12th – 15th of May 2019 Place: Jachranka, Poland The seminar was organized by the Faculty of Materials…


Kick off Meeting: The official meeting starting the 3DMPWire. Material-efficient Cu wire-based 3D printing technology project

6 czerwca 2019

Date: the 30th of May 2019 Place: ŁUKASIEWICZ Research Network – Institute of Non-Ferrous Metals, Gliwice An official meeting to…


Seminar organized by the Association of SITMN at ŁUKASIEWICZ-IMN Gliwice

30 kwietnia 2019

Date: the 16th of April 2019 Place: Łukasiewicz Research Network – Institute of Non-Ferrous Metals, Gliwice On the initiative of…


Kielce Trade Fairs

13 kwietnia 2019

Date: the 27th to 28th March 2019 Place: Kielce As part of this year’s edition of the fair, in addition…


Project Partners

Łukasiewicz Research Network - Institute of Non-Ferrous Metals

  • Development of the Cu-based alloys
  • Development of production technology of feedstock materials for WAAM
  • Wire arc additive manufacturing at laboratory scale
  • Materials investigations

Ghent University

  • Corrosion-fatigue investigations
  • Tests of the prototypes in seawater environment
  • Educational activities

Italian National Agency for New Technologies, Energy and Sustainable Economic Development

  • Material investigations
  • Mechanical proporties

Gefertec GmbH

  • Development of the production process parameters by means of 3DMP technology
  • Implementation of the results of the project (end user)
  • Manufacturing of the new products

Tecnalia Research and Innovation

  • Erosion tests
  • Non-destructive tests

Acknowledgements

The project „3DMPWire. Material-efficient Cu wire-based 3D printing technology”, 2019-2021 (Upscaling) is cofunded by EIT RawMaterials.