Material-efficient Cu wire-based 3D printing technology

Area Acceleration (D2) Segment Upscaling (D2.2) Duration 2019/01/01-2021/12/31

News

Materializzando OFF

21 listopada 2019

Date: 26 September, 2019 Place: ENEA Faenza Laboratories (Italy) The 26th September 2019 “Materializzando OFF” took place in Faenza. This…


A visit from the Głogów Copper Smelter representatives

21 listopada 2019

Date: 17 October, 2019 Place: Łukasiewicz Research Network – Institute of Non-Ferrous Metals, Gliwice A meeting with The Głogów Copper…


Meeting with Gefertec – scientific cooperation

13 listopada 2019

Date: 14-16 October, 2019 Place: Łukasiewicz Research Network – Institute of Non-Ferrous Metals, Gliwice This was a meeting between the…


Material Technologies in Silesia Conference 2019

28 października 2019

DATE: 13-16 October, 2019 PLACE: Zawiercie, Poland This conference aims at integrating the scientific and industrial environments, as well as…


A Meeting with a Business Representative

28 października 2019

Date: 8 October, 2019 Place: ŁUKASIEWICZ Research Network – Institute of Non-Ferrous Metals, Gliwice This meeting was between representatives of…


The First European Conference on Structural Integrity of Additively Manufactured Materials

12 września 2019

Date: 9-11 September, 2019 Place: Trondheim, Norway From the 9th to the 11th of September Joanna Kulasa and Aleksander Kowalski…


Project Partners

Łukasiewicz Research Network - Institute of Non-Ferrous Metals

  • Development of the Cu-based alloys
  • Development of production technology of feedstock materials for WAAM
  • Wire arc additive manufacturing at laboratory scale
  • Materials investigations

Ghent University

  • Corrosion-fatigue investigations
  • Tests of the prototypes in seawater environment
  • Educational activities

Italian National Agency for New Technologies, Energy and Sustainable Economic Development

  • Material investigations
  • Mechanical proporties

Gefertec GmbH

  • Development of the production process parameters by means of 3DMP technology
  • Implementation of the results of the project (end user)
  • Manufacturing of the new products

Tecnalia Research and Innovation

  • Erosion tests
  • Non-destructive tests

Acknowledgements

The project „3DMPWire. Material-efficient Cu wire-based 3D printing technology”, 2019-2021 (Upscaling) is cofunded by EIT RawMaterials.