Material-efficient Cu wire-based 3D printing technology

Area Acceleration (D2) Segment Upscaling (D2.2) Duration 2019/01/01-2021/12/31

3DMPWire Project

The development of new materials intended for marine equipment manufacturing during the 3D Metal Printing (3DMP®) process.

3DMPWire Project

Project Partners

International co-operation of 3 Research Institutes: ŁUKASIEWICZ – Institute of Non-Ferrous Metals, ENEA, TECNALIA; 1 University: Ghent University and 1 Industry Partner: GEFERTEC consisting of representatives from all three corners of the Knowledge Triangle.

Project Partners

Goals & objectives

The development of the manufacturing technology of components made of Cu-based alloys by means of the 3DMP® technology.

Goals & objectives

3DMPWire® project addresses needs for more efficient and waste-free production, specifically production of corrosion-resistant components operating in marine environments using newly developed Cu-based alloys. Upscaling will bring to TRL9 technology of production of components by 3D printing from wires. Thanks to the application of wires significant reduction of material loss (with a factor of 10), production costs and energy consumption will be reached. Moreover, the 3DMP® technology, developed within this project, can be used to manufacture other products, in many branches of the industry, using the new Cu-based alloys wires.

 

Project Partners

Łukasiewicz Research Network - Institute of Non-Ferrous Metals

  • Development of the Cu-based alloys
  • Development of production technology of feedstock materials for WAAM
  • Wire arc additive manufacturing at laboratory scale
  • Materials investigations

Ghent University

  • Corrosion-fatigue investigations
  • Tests of the prototypes in seawater environment
  • Educational activities

Italian National Agency for New Technologies, Energy and Sustainable Economic Development

  • Material investigations
  • Mechanical proporties

Gefertec GmbH

  • Development of the production process parameters by means of 3DMP technology
  • Implementation of the results of the project (end user)
  • Manufacturing of the new products

Tecnalia Research and Innovation

  • Erosion tests
  • Non-destructive tests

Acknowledgements

The project „Material-efficient Cu wire-based 3D printing technology”, 2019-2021 (Upscaling) is cofunded by EIT RAW MATERIALS.