Material-efficient Cu wire-based 3D printing technology

Area Acceleration (D2) Segment Upscaling (D2.2) Duration 2019/01/01-2021/12/31

News

Kielce Trade Fairs

13 kwietnia 2019

Date: 27-28 March, 2019 Place: Kielce, Poland As part of this year’s edition of the fair, in addition to a…


A meeting with The Głogów Copper Smelter representatives

13 kwietnia 2019

Date: 26 March, 2019 Place: Gliwice, Poland As part of the activity of the Association of Non-Ferrous Metals Engineers and…


Inauguration Conference „New solutions, progress and challenges in the industry of non-ferrous metals processing”

12 kwietnia 2019

Date: 20_22 March, 2019 Place: Kraków, Poland The meeting started a series of conferences titled ‘Directions of development and sustainable…


Meeting with the entrepreneur – Project Partner GEFERTEC

12 kwietnia 2019

Date: 13_14 February, 2019 Place:  Gefertec GmbH Berlin, Germany A meeting of the Institute of Non-Ferrous Metals with Gefertec GmbH,…


Project Partners

Łukasiewicz Research Network - Institute of Non-Ferrous Metals

  • Development of the Cu-based alloys
  • Development of production technology of feedstock materials for WAAM
  • Wire arc additive manufacturing at laboratory scale
  • Materials investigations

Ghent University

  • Corrosion-fatigue investigations
  • Tests of the prototypes in seawater environment
  • Educational activities

Italian National Agency for New Technologies, Energy and Sustainable Economic Development

  • Material investigations
  • Mechanical proporties

Gefertec GmbH

  • Development of the production process parameters by means of 3DMP technology
  • Implementation of the results of the project (end user)
  • Manufacturing of the new products

Tecnalia Research and Innovation

  • Erosion tests
  • Non-destructive tests

Acknowledgements

The project „3DMPWire. Material-efficient Cu wire-based 3D printing technology”, 2019-2021 (Upscaling) is cofunded by EIT RawMaterials.