Material-efficient Cu wire-based 3D printing technology

Area Acceleration (D2) Segment Upscaling (D2.2) Duration 2019/01/01-2021/12/31

SITMN Scientific and Technical Conference 3 grudnia 2021

SITMN Scientific and Technical ConferenceSITMN Scientific and Technical Conference

Date: 28th-29th October 2021

Place: Karpacz

The 203rd SITMN Scientific and Technical Conference took place on the 28th – 29th October in Karpacz. The lead topic of it was the 50th anniversary of „KGHM Głogów”. It was a time for meetings with representatives of the industry, sharing experiences and promoting the project.

Project Partners

Łukasiewicz Research Network - Institute of Non-Ferrous Metals

  • Development of the Cu-based alloys
  • Development of production technology of feedstock materials for WAAM
  • Wire arc additive manufacturing at laboratory scale
  • Materials investigations

Ghent University

  • Corrosion-fatigue investigations
  • Tests of the prototypes in seawater environment
  • Educational activities

Italian National Agency for New Technologies, Energy and Sustainable Economic Development

  • Material investigations
  • Mechanical proporties

Gefertec GmbH

  • Development of the production process parameters by means of 3DMP technology
  • Implementation of the results of the project (end user)
  • Manufacturing of the new products

Tecnalia Research and Innovation

  • Erosion tests
  • Non-destructive tests

Supported by