Material-efficient Cu wire-based 3D printing technology

Area Acceleration (D2) Segment Upscaling (D2.2) Duration 2019/01/01-2021/12/31

Warsaw Industry Week 14 grudnia 2022

Warsaw Industry Week

Date: 7-9th November 2022

Place: Nadarzyn, Poland

During the Warsaw Industry Week Łukasiewicz – IMN presented, among others the high-performance 3D printing technology using a copper-based wire feedstock, which enables the production of complex-shaped elements without porosity, including relatively large elements at low cost of the feedstock material. Also the wires and propeller manufactured in the 3DMPWire project were exhibited.


Project Partners

Łukasiewicz Research Network - Institute of Non-Ferrous Metals

  • Development of the Cu-based alloys
  • Development of production technology of feedstock materials for WAAM
  • Wire arc additive manufacturing at laboratory scale
  • Materials investigations

Ghent University

  • Corrosion-fatigue investigations
  • Tests of the prototypes in seawater environment
  • Educational activities

Italian National Agency for New Technologies, Energy and Sustainable Economic Development

  • Material investigations
  • Mechanical proporties

Gefertec GmbH

  • Development of the production process parameters by means of 3DMP technology
  • Implementation of the results of the project (end user)
  • Manufacturing of the new products

Tecnalia Research and Innovation

  • Erosion tests
  • Non-destructive tests

Supported by