Material-efficient Cu wire-based 3D printing technology

Area Acceleration (D2) Segment Upscaling (D2.2) Duration 2019/01/01-2021/12/31

EIT RawMaterials CLC East Partner Meeting 16 grudnia 2019

Date: 26-28 November, 2019

Place: Graz, Austria

This meeting was a time for presentations of projects, of ECLC Strategy, and networking. It was a chance to learn about KAVA Call 7 and also to take part in workshops about KAVA Project proposal preparation. During this meeting second review of the project 3DMPWire took place.

Project Partners

Łukasiewicz Research Network - Institute of Non-Ferrous Metals

  • Development of the Cu-based alloys
  • Development of production technology of feedstock materials for WAAM
  • Wire arc additive manufacturing at laboratory scale
  • Materials investigations

Ghent University

  • Corrosion-fatigue investigations
  • Tests of the prototypes in seawater environment
  • Educational activities

Italian National Agency for New Technologies, Energy and Sustainable Economic Development

  • Material investigations
  • Mechanical proporties

Gefertec GmbH

  • Development of the production process parameters by means of 3DMP technology
  • Implementation of the results of the project (end user)
  • Manufacturing of the new products

Tecnalia Research and Innovation

  • Erosion tests
  • Non-destructive tests

Acknowledgements

The project „3DMPWire. Material-efficient Cu wire-based 3D printing technology”, 2019-2021 (Upscaling) is cofunded by EIT RawMaterials.