Material-efficient Cu wire-based 3D printing technology

Area Acceleration (D2) Segment Upscaling (D2.2) Duration 2019/01/01-2021/12/31

Aluminium and Nonfermet 27 października 2021

Aluminium and NonfermetAluminium and NonfermetAluminium and Nonfermet

Date : 19th – 21st October 2021

Place: Kielce

On October the 19th – 21st 2021, the 16th International Fair of Aluminium & Technology, Materials and Non-Ferrous Metal products ALUMINIUM & NONFERMET was held in Kielce. During this event, companies offering new technologies, modern machines and devices used in the non-ferrous metal industry, as well as raw materials, components and materials used in metallurgical processes presented their offer. The representatives of Łukasiewicz – The Institute of Non-Ferrous Metals who took part in the exhibition presented WAAM 3D printing technology and the 3DMPWire project. They showed the wires manufactured in the Institute dedicated to WAAM 3D printing and also the printed samples.

Project Partners

Łukasiewicz Research Network - Institute of Non-Ferrous Metals

  • Development of the Cu-based alloys
  • Development of production technology of feedstock materials for WAAM
  • Wire arc additive manufacturing at laboratory scale
  • Materials investigations

Ghent University

  • Corrosion-fatigue investigations
  • Tests of the prototypes in seawater environment
  • Educational activities

Italian National Agency for New Technologies, Energy and Sustainable Economic Development

  • Material investigations
  • Mechanical proporties

Gefertec GmbH

  • Development of the production process parameters by means of 3DMP technology
  • Implementation of the results of the project (end user)
  • Manufacturing of the new products

Tecnalia Research and Innovation

  • Erosion tests
  • Non-destructive tests

Supported by