Material-efficient Cu wire-based 3D printing technology

Area Acceleration (D2) Segment Upscaling (D2.2) Duration 2019/01/01-2021/12/31

22nd International Conference on Advances in Materials & Processing Technologies 26 listopada 2019

Date: 20-24 October, 2019

Place: Taipei, Taiwan

This conference is a big international event concerning the topic of materials and various processing methods. This year the  topic widely discussed during this conference, apart from the materials, was 3D printing. The 3DMPWire project and the WAAM technology were presented in a poster session by our colleague Joanna Kulasa, who also won the prize for a ‚Researcher with  future.’                                               

Project Partners

Łukasiewicz Research Network - Institute of Non-Ferrous Metals

  • Development of the Cu-based alloys
  • Development of production technology of feedstock materials for WAAM
  • Wire arc additive manufacturing at laboratory scale
  • Materials investigations

Ghent University

  • Corrosion-fatigue investigations
  • Tests of the prototypes in seawater environment
  • Educational activities

Italian National Agency for New Technologies, Energy and Sustainable Economic Development

  • Material investigations
  • Mechanical proporties

Gefertec GmbH

  • Development of the production process parameters by means of 3DMP technology
  • Implementation of the results of the project (end user)
  • Manufacturing of the new products

Tecnalia Research and Innovation

  • Erosion tests
  • Non-destructive tests


The project „3DMPWire. Material-efficient Cu wire-based 3D printing technology”, 2019-2021 (Upscaling) is cofunded by EIT RawMaterials.